EXCELLENT THERMAL CONDUCTIVITY - 85x45x1.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
𝗖𝗢𝗢𝗟 𝗜𝗡 𝗦𝗘𝗖𝗢𝗡𝗗𝗦 -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
𝗘𝗔𝗦𝗬 𝗧𝗢 𝗨𝗦𝗘 -- 100 x 100mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Cool in Seconds -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
Easy to Use -- 120 x 120mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease.
✦[ EXCELLENT THERMAL CONDUCTIVITY ]:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
✦[ SUPER RELIABLE & DURABLE ]:High temperature performance in -40 ℃——205 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
HIGH VALUE 4 PACKS - Comes with 4 packs of different sizes(0.5mm, 1mm, 1.5mm and 2mm) in one package. Suits various of cooling demands in electronic components like CPU / GPU/ chipset / motherboard / module and the heat sink
EXCELLENT THERMAL CONDUCTIVITY - Made of thermal silica gel with a heat conductivity of 6.0W/m.k, the thermal pad will lower the temperature in few seconds
📢【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
⚡【SUPER RELIABLE & DURABLE 】:High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Excellent Thermal Conductivity - With upgraded thermally conductive silicone materia, the thermal conductivity is up to 18 W/mK, the Themalright thermal pads greatly improve heat transfer between electronic components and effectively cool down in seconds.
Safety and stability - high temperature performance of -40 ℃ - 203 ℃ will not melt, non-toxic, tasteless, anti-corrosion, wear-resistant, anti-static, flame retardant, pressure resistance, good insulation.
EXCELLENT THERMAL CONDUCTIVITY - 85x45x1.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
𝗖𝗢𝗢𝗟 𝗜𝗡 𝗦𝗘𝗖𝗢𝗡𝗗𝗦 -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
𝗘𝗔𝗦𝗬 𝗧𝗢 𝗨𝗦𝗘 -- 100 x 100mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Cool in Seconds -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
Easy to Use -- 120 x 120mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease.
✦[ EXCELLENT THERMAL CONDUCTIVITY ]:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
✦[ SUPER RELIABLE & DURABLE ]:High temperature performance in -40 ℃——205 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
HIGH VALUE 4 PACKS - Comes with 4 packs of different sizes(0.5mm, 1mm, 1.5mm and 2mm) in one package. Suits various of cooling demands in electronic components like CPU / GPU/ chipset / motherboard / module and the heat sink
EXCELLENT THERMAL CONDUCTIVITY - Made of thermal silica gel with a heat conductivity of 6.0W/m.k, the thermal pad will lower the temperature in few seconds
📢【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
⚡【SUPER RELIABLE & DURABLE 】:High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Excellent Thermal Conductivity - With upgraded thermally conductive silicone materia, the thermal conductivity is up to 18 W/mK, the Themalright thermal pads greatly improve heat transfer between electronic components and effectively cool down in seconds.
Safety and stability - high temperature performance of -40 ℃ - 203 ℃ will not melt, non-toxic, tasteless, anti-corrosion, wear-resistant, anti-static, flame retardant, pressure resistance, good insulation.
EXCELLENT THERMAL CONDUCTIVITY - 85x45x1.5mm, Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
𝗖𝗢𝗢𝗟 𝗜𝗡 𝗦𝗘𝗖𝗢𝗡𝗗𝗦 -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
𝗘𝗔𝗦𝗬 𝗧𝗢 𝗨𝗦𝗘 -- 100 x 100mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease
EXCELLENT THERMAL CONDUCTIVITY - Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE - High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Cool in Seconds -- With a thermal conductivity of 13W/mK, our thermal pad greatly improves heat transfer between the electronic elements and effectively cool the temperature down in seconds. It also provides insulation, shock absorption, extra sealing and protection for your electronic elements
Easy to Use -- 120 x 120mm with slightly sticky on dual sides, cut it freely for your customized demand, tear off the dual-side protective film and paste it. The soft and compressible upgraded thermal material allows 30-40% compression rate which is a perfect substitute for traditional radiator compound grease.
✦[ EXCELLENT THERMAL CONDUCTIVITY ]:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
✦[ SUPER RELIABLE & DURABLE ]:High temperature performance in -40 ℃——205 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
HIGH VALUE 4 PACKS - Comes with 4 packs of different sizes(0.5mm, 1mm, 1.5mm and 2mm) in one package. Suits various of cooling demands in electronic components like CPU / GPU/ chipset / motherboard / module and the heat sink
EXCELLENT THERMAL CONDUCTIVITY - Made of thermal silica gel with a heat conductivity of 6.0W/m.k, the thermal pad will lower the temperature in few seconds
📢【EXCELLENT THERMAL CONDUCTIVITY】:Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdowm voltage: 9.8KV; Conductivity: None,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
⚡【SUPER RELIABLE & DURABLE 】:High temperature performance in -40 ℃ - 200 ℃ will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
Excellent Thermal Conductivity - With upgraded thermally conductive silicone materia, the thermal conductivity is up to 18 W/mK, the Themalright thermal pads greatly improve heat transfer between electronic components and effectively cool down in seconds.
Safety and stability - high temperature performance of -40 ℃ - 203 ℃ will not melt, non-toxic, tasteless, anti-corrosion, wear-resistant, anti-static, flame retardant, pressure resistance, good insulation.
【High performance】Excellent performance comes from its first-class data, thermal conductivity up to 9.5w/m.k, it has a good record of high cooling performance.
【Security】It does not contain any metal particles, oil-free solvents, non conductive, non corrosive, harmless, It is friendly to CPU and GPU and will not damage electronic components.
EXCELLENT THERMAL CONDUCTIVITY:Thermal Paste conductivity 1.93 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY: The Thermal Compound Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -30℃-280℃ environment. High heat dissipation performance, high-cost performance. It will not compromise over time
【High performance】Excellent performance comes from its first-class data, thermal conductivity up to 14.3W/m.k, it has a good record of high cooling performance, Its high thermal conductivity ensures the speed and efficiency of heat conduction, which is the choice of overclocking game player.
【Stability】The available temperature is -250 ℃ / +300℃, thermal resistance < 0.0028, Density is 2.6 (25℃). Even in high or low temperature environment, its cooling advantage will not be affected.
【Excellent Performance】Excellent performance origins from its outstanding data, the thermal conductivity is (up to) 14W/M.K, with a good record of good cooling performance, its high thermal conductivity ensures the speed and efficiency of heat transfer, becomes overclocker customer's Choice
【Stability】Work temperature is -250°/+380°, the thermal resistance is
K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc).
K4-PRO has thermal conductivity K>4,6 W/m.K (3 times higher than common thermal pastes that are used on computers and comercial electronics) Computer Systems materials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014)
【High performance】Excellent performance comes from its first-class data, thermal conductivity up to 14.3W/m.k, it has a good record of high cooling performance, Its high thermal conductivity ensures the speed and efficiency of heat conduction, which is the choice of overclocking game player.
【Stability】Work temperature is -250°/+300°, the thermal resistance is
High Thermal Conductivity: This thermal paste features high performance and high thermal conductivity(3.2W/m.k).
Safe and Reliable: This thermal conductive paste is non electrical conductive, nontoxic, non corrosive, and it does not contain metal, eliminating risks of short circuit.
【EXCELLENT THERMAL CONDUCTIVITY】 - It is composed of carbon particles and has extremely high thermal conductivity 6.5 W/mK,. Metal-free and non-conductive, more protection to the CPU and VGA card. improve the heat transfer between the electronic elements and effectively cool the contact surface, ensure heat dissipated quickly & efficiently.
【HIGH PERFORMANCE & DURABLE USE】 - High temperature performance in -30℃ - 280℃, Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste, Non-volatile, Non-corrosive, Non-toxic and odorless, high-stability liquid compound lasts for 5 years with no drying, cracking or change in consistency.
【High performance】Excellent performance comes from its first-class data, thermal conductivity up to 13.8w/m.k, it has a good record of high cooling performance.
【Stability】The available temperature is -220℃/ +380℃, thermal resistance < 0.01, Density is 2.9 (25℃). Even in high or low temperature environment, its cooling advantage will not be affected.